2025 Electronics Packaging Symposium

GE Aerospace, IBM Research and IEEC, CAMM-Binghamton University invite you to attend this two-day event on September 3 and 4, 2025 at GE Aerospace Research in Niskayuna NY.
This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics of:
• Future of Computing for HPC and AI
• mm Wave, 5G and 6G in Packaging
• Power Electronics / Harsh Environments
• Thermal Challenges in Advance Packaging
• Flexible & Wearable Electronics
• Heterogeneous Integration
• Advance Substrates
• Photonics Packaging
Agenda : https://www.binghamton.edu/ieec/eps/agenda.html
This year's program includes keynotes, 8 sessions with technical presentations, a student poster session with students from local Universities, and exhibits from leading companies.
We will have a special panel and a workshop, we will update this page once plans are finalized.
We aim to share quality, up-to-date information through different lenses on trending electronics packaging topics, and provide opportunities to network, share ones expertise, learn, and build partnerships.
We highly encourage graduate students to join us in the poster session to showcase their research! Make sure to register.
Due to security requirements at GE Aerospace Research, registration will close 2 weeks before the event, no walk-ins are allowed. Additional security questions were added to the registration page, make sure to provide answers to all questions.
Registration , required forms and program details can be found on our website:
https://www.binghamton.edu/ieec/eps/index.html
Contact us at: epsympos@binghamton.edu
REGISTER TODAY and join a community which seeks advancement in the electronics packaging field. We look forward to seeing you this fall.
Agenda:
Agenda : https://www.binghamton.edu/ieec/eps/agenda.html
GE Aerospace Research, Niskayuna, New York, United States, 12309