Broadband Dielectric Characterization and Design Optimization of Silicate Materials for Advanced Packaging Applications

This webinar, conducted in partnership with IEEE YP AGs from Germany, France, Benelux, Jordan, Tunisia, and South Africa, focused on broadband dielectric characterization and the design optimization of silicate materials for advanced electronic packaging. Participants were introduced to measurement techniques, material selection strategies, and optimization approaches to enhance performance in high-frequency applications. The session emphasized practical solutions for engineers working on next-generation packaging technologies and material innovation.
Virtual: https://events.vtools.ieee.org/m/513349