2 events found.
Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
Bldg: HUB 350, 350 Legget Dr, Kanata, Ontario, CanadaSilicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous […]
Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
Bldg: HUB 350, 350 Legget Dr, Kanata, Ontario, CanadaSilicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous […]