Club Connect! ⛳
Bldg: Hop Shots Mini Golf, 614 Glenwood Ave, Suite B, Raleigh, North Carolina, United States, 27603🚀 Join us at Club Connect! ⛳🍻 Tech, tee-offs, and top-tier networking—what more could you ask for? Club Connect brings together innovators, engineers, and young professionals for an evening of mini-golf, drinks, and meaningful connections. 📅 April 24 | 5:30-7:30 PM 📍 Raleigh Beer Garden 🎟 Spots are limited! RSVP now: Brought to you by […]
IEEE RRVS: April 2025 Meeting
Room: 1322, Bldg: Woodward Technology Center (WTC), 3301 N Mulford Rd,, Rockford, Illinois, United States, 61114Join us the IEEE RRVS CCS & IAS, WIE, YP, Life members chapter Meeting at 6pm. TITLE: TBD Program: TBD About the Speaker: TBD Agenda: 6:00 PM Gathering, Networking & Dinner 7:15 PM Presentation starts 8:30 PM Adjourn Room: 1322, Bldg: Woodward Technology Center (WTC), 3301 N Mulford Rd,, Rockford, Illinois, United States, 61114
Productivity Webinars- Effective Communication and Time Managment
Virtual: https://events.vtools.ieee.org/m/479948TWO productivity seminars are being planned for Saturday April 26th starting at 9:30 AM (US-Central time). The events will be online for those who register for the events. The first webinar entitled TOPIC 1: Will They Listen to Me?-Speaking More Effectively will be presented by Dr Farrukh Ahmad, a Distinguished Toastmaster and a GeoScientist. will […]
Binghamton Motorsports Reception
Room: Rotunda, Bldg: ITC, 85 Murray Hill Road, Binghamton University, VESTAL, New York, United States, 13850Date: April 26, 2025 Time: 4:00 – 6:30 PM Location: ITC Rotunda Host: Students from the Binghamton Motorsport (https://binghamtonmotorsports.com/) Sponsors: IEEE Binghamton Section, Binghamton Electrical and Computer Engineering Department Event Details: The Binghamton Motorsport Annual Reception is an evening celebration to honor the hard work, dedication, and achievements of Binghamton Motorsport throughout the year. This […]
Binghamton Motorsports Reception
Room: Rotunda, Bldg: ITC, 85 Murray Hill Road, Binghamton University, VESTAL, New York, United States, 13850Date: April 26, 2025 Time: 4:00 – 6:30 PM Location: ITC Rotunda Host: Students from the Binghamton Motorsport (https://binghamtonmotorsports.com/) Sponsors: IEEE Binghamton Section, Department of Electrical and Computer Engineering at Binghamton University Event Details: The Binghamton Motorsport Annual Reception is an evening celebration to honor the hard work, dedication, and achievements of Binghamton Motorsport throughout […]
2025 IEEE / LES / ASCE CRAWFISH BOIL
Bldg: Main Pavilion, 500 Girard Park Drive, Lafayette, Louisiana, United States, 705032025 IEEE/LES/ASCE CRAWFISH BOIL WHEN: Tuesday April 29, 2025 from 5:00 PM to 7:30 PM WHERE: Main Pavilion - Girard Park 500 Girard Park Drive Lafayette, LA 70503 IEEE is pleased to invite you to join us for our annual crawfish boil at the Girard Park Pavilion on April 29th from 5:00 pm to 7:00 […]
2025 IEEE / LES / ASCE CRAWFISH BOIL
Bldg: Main Pavilion, 500 Girard Park Drive, Lafayette, Louisiana, United States, 705032025 IEEE/LES/ASCE CRAWFISH BOIL WHEN: Tuesday April 29, 2025 from 5:00 PM to 7:30 PM WHERE: Main Pavilion - Girard Park 500 Girard Park Drive Lafayette, LA 70503 IEEE is pleased to invite you to join us for our annual crawfish boil at the Girard Park Pavilion on April 29th from 5:00 pm to 7:00 […]
IEEE NA Section Exec Meeting # 02 – 2025
Virtual: https://events.vtools.ieee.org/m/467717ExCom meeting for the Northern Australia Section, Chapters, Affinity Groups, Student Branches and NT Subsection. Virtual: https://events.vtools.ieee.org/m/467717
Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
Bldg: HUB 350, 350 Legget Dr, Kanata, Ontario, CanadaSilicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic […]
Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
Bldg: HUB 350, 350 Legget Dr, Kanata, Ontario, CanadaSilicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic […]
Caffeinate & Connect: Networking 101 (IEEE Young Professionals Networking Hour)
Room 312 W Riverside Ave, Spokane, WA, United StatesAre you good at Networking? Do you want to be? Join us for "Caffeinate and Connect," a casual coffee hour designed to help STEM students and young professionals develop their networking skills! This event is a great opportunity to meet peers in your field, learn tips for professional networking, and gain insights from a few […]
IEEE Baltimore Robot Challenge – in person component
1415 Key Highway Capitol Heights, MD, United StatesRobot Challenge competition including time trials for robots and oral presentations by the student teams. This is an exciting event for Middle School and High School students who have built robots from scratch. We need Judges! The interaction with working engineers is invaluable. Competition ends early afternoon, depending on the number of entries. Please join […]